cyanide copper

The process of cyanide copper electroplating is replaced by the proposed process of pyrophosphate electroplating copper on magnesium alloy.

用研究的焦磷酸盐镀铜工艺代替氰化镀铜工艺作为过渡铜镀层的无氰镀工艺。

Error Analysis and Concentration control of Free Cyanide in Copper Plating Bath

氰化镀铜液中游离氰化钠的分析误差和含量控制

Non-cyanide alkaline copper plating

无氰碱性镀铜

A process of non-cyanide alkaline copper plating

无氰碱性镀铜清洁生产工艺的研究

The results show that the double zine dip process does not need cyanide copper plating for bottom plate;

结果表明，以二次浸锌法进行预处理，无需氰化镀铜打底；

The process has greater covering power than cyanide copper plating process by comparison.

通过比较该工艺与氰化镀铜工艺的深镀能力,可知前者深镀能力明显优于后者.

The practice proves that the three key points i.e. anode solubility, ability to prevent chemical replacement and covering power for the new process can meet the demand of continuous production in batches. Cyanide strike copper plating process can be replaced by the new process completely.

实践证明，该工艺在阳极溶解性、防化学置换及深镀能力这3个关键环节上达到大批量连续化生产的要求，完全可取代氰化预镀铜工艺。

A new copper plating bath is found which capability is close to cyanide copper plating bath and can be the good substitute of cyanide copper plating bath in actual production.

本课题的目的是研究出一种在性能上与氰化镀铜液相近，并且在实际生产中也能够切实取代氰化镀铜工艺的无氰碱性镀铜工艺。